lead-free parts pb a - 2006 09 - oct. LDBK43133 ligitek electronics co.,ltd. property of ligitek only LDBK43133 round type led lamps data sheet doc. no : qw0905- rev. : date :
ligitek electronics co.,ltd. property of ligitek only 1/5 page 5.1 5.55 part no.LDBK43133 package dimensions 1.5max 6.6 1.0 0.5 typ 1.0min - + 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 30 0 directivity radiation -30 60 100% 50%75% 25% 0 25% -60 100%75% 50% 25.0min
water clear color lens ingan/gan material LDBK43133 part no blue emitted 1800 luminous intensity @20ma(mcd) typ. 30 spectral halfwidth nm 470 dominant wave length dnm 4.0 max. forward voltage @ ma(v) 3.5 typ. 20 1100 min. viewing angle 2 1/2 (deg) 30 2/5 page ligitek electronics co.,ltd. property of ligitek only unit ma ma a v mw 30 100 dbk ratings 50 150 ir -20 ~ +80 -30 ~ +100 120 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature electrostatic discharge( * ) reverse current @5v power dissipation typical electrical & optical characteristics (ta=25 ) symbol esd t opr tstg i f pd i fp absolute maximum ratings at ta=25 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no.LDBK43133
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.03.04.0 0 1 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 400500550 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40-20 100 80 60 40 20 0.0 60100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip page3/5 part no.LDBK43133
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 120 preheat 50 100 2 /sec max temp( c) 260 260 c3sec max time(sec) 150 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 4/5 part no.LDBK43133
page 5/5 reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test itemtest condition operating life test reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description ligitek electronics co.,ltd. property of ligitek only mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs part no.LDBK43133
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